MediaTek Helio P70 Octa-Core 12nm processor with improved multi-core AI processing, Dual 4G VoLTE announced

MediaTek-Helio-P70

MediaTek just introduced Helio P70 chipset based on 12nm TSMC FinFET technology. It  is built with TSMC’s 12nm FinFET technology, same as the P60. The Helio P70 comes with multi-core APU operating at up to 525 MHz for fast and efficient edge-AI processing. The Company says that AI engine delivers a 10 to 30% AI processing boost compared to the Helio P60.

It has four ARM Cortex-A73 2.1 GHz CPUs and four ARM Cortex-A53 2.0 GHz CPUs in an Octa-core big.LITTLE configuration. It has ARM Mali-G72 MP3 GPU operating at up to 900 MHz, which promises a 13% performance improvement, compared to the Helio P60.

The company said that “In popular games that frequently generate a heavy load across the SoC, the P70 provides 7% better DOU and up to 35% lower power usage compare to the P60”. It has support for 20:9 displays at Full HD+ resolution.

MediaTek-Helio-P70-AI

MediaTek’s AI video encoder enhances the video call quality even when connection is limited. It can be used for video calls including Skype calls, Facebook video calls and Youtube live video streaming. It has improved deep-learning facial detection that promises up to 90% accuracy. It has Dual 4G VoLTE support and the MediaTek’s smart antenna technology automatically uses the best antenna combination to sustain signal quality.

Comparison between Helio P60 and P70

 Helio P70  Helio P60
Process TSMC 12nm TSMC 12nm
Apps CPU 4x Cortex-A73 @ 2.1 GHz
4x Cortex-A53 @ 2.0 GHz
4x Cortex-A73 @ 2.0 GHz
4x Cortex-A53 @ 2.0 GHz
Memory 1X LPDDR3 933MHz, 2X LPDDR4x Up to 1800MHz up to 8GB (LPDDR4x), eMMC 5.1 / UFS 2.1 1X LPDDR3 933MHz, 2X LPDDR4x Up to 1800MHz up to 8GB (LPDDR4x), eMMC 5.1 / UFS 2.1
Camera 24+16MP or 32MP camera @ 30fps. (AI) Facial Detection & Scene Detection; Hardware Warping Engine (EIS); Anti-Blooming Engine; MEMA 3DNR; Multi-Frame Noise reduction; Real-time HDR recording and viewing; Zig-Zag HDR; RAW-domain multi-frame HDR; PDAF 16+20MP or 32MP camera @ 30fps. (AI) Facial Detection & Scene Detection; Hardware Warping Engine (EIS); Anti-Blooming Engine; MEMA 3DNR; Multi-Frame Noise reduction; Real-time HDR recording and viewing; Zig-Zag HDR; RAW-domain multi-frame HDR; PDAF
Video Decode 2160p (2160 x 1080), h.264, h.265 / HEVC at 30 fps 2160p (2160 x 1080), h.264, h.265 / HEVC at 30 fps
Video Encode 2160p h.264 at 30 fps 2160p h.264 at 30 fps
Graphics ARM Mali-G72 MP3 at up to 900MHz ARM Mali-G72 MP3 at up to 800MHz
Modem Cat-7 DL / Cat-13 UL, 2×2 UL CA, TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71 Cat-7 DL / Cat-13 UL
2×2 UL CA, TAS 2.0, HUPE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71
Connectivity Integrated Wi-Fi 802.11 ac GPS/Glonass/Beidou ANT+, Bluetooth 4.2 /FM Integrated Wi-Fi 802.11 ac GPS/Glonass/Beidou ANT+, Bluetooth 4.2 /FM

The Helio P70 chipsets are in production now. It is expected to available in smartphones by November of this year.

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